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Full-Cycle Engineering Services

Every service shaped by our nine core engineering competencies โ€” from the first architecture decision to the final production handoff.

What We Do

Nine Specializations. One Integrated Team.

Pabst Electronics provides comprehensive electronics design services. Whether you need a complete product development program or targeted support at a specific phase, we bring the same level of rigor and expertise to the work.

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Design for Safety

Expert-level compliance design for IEC 61010, IEC 60335, IEC/UL 60730, IEC 60079, UL, and CCC โ€” with engineers who have followed certification tests firsthand.


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02
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Design for Reliability

Structured reliability engineering โ€” derating analysis, thermal analysis, worst-case circuit analysis, MTBF estimation, and protection circuit evaluation.


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UI/UX Design

Hardware user interface design informed by deep electronics engineering knowledge โ€” bridging user experience with the realities of hardware constraints and safety requirements.


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04
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Design for Manufacturability

Assembly-aware PCB and BOM design that reduces cost, rework, production time, and field failures โ€” DFM applied throughout the entire development process.


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Design for Testability

ICT and FVT access engineered into the PCB from the layout stage โ€” full test coverage, lower fixture costs, and a faster path to production line qualification.


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06
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EMI/EMC Design

IEC 61000-3 emissions and IEC 61000-4 immunity design โ€” including protection circuit design and evaluation โ€” by engineers with first-hand compliance test experience.


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Signal Integrity Design

Best-practice SI design combined with post-layout simulation โ€” controlled impedance, differential pairs, PDN design, and crosstalk mitigation for long-term field quality.


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Full Design Documentation

Every component calculated and documented โ€” including pull-down resistors. Engineering integrity that ensures compliance traceability and long-term product maintainability.


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Test Plans

Complete ICT, FVT, EOL, and pre-compliance test plan packages aligned to IEC, UL, and CCC standards โ€” delivered before production begins.


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How We Work

The Pabst Electronics Development Workflow

A disciplined, integrated process that applies all nine engineering competencies from the very first phase.

Development Phases

1
Concept & System ArchitectureBlock diagrams, technology selection, standards identification, design rules definition
2
Schematic DesignFull schematics with compliance, derating, protection circuits, and SI considerations
3
PCB LayoutDFM + DFT + EMC + SI applied simultaneously in layout
4
Firmware & UI/UXCo-developed embedded software and hardware interface design
5
Verification & DocumentationSI simulation, DFM review, compliance check, full component calculations
6
Certification & Production HandoffTest plans, technical file, lab coordination, manufacturing package

Why Integration Matters

Most electronics development failures are not caused by a single bad decision โ€” they are caused by decisions made in isolation. A schematic designed without EMC awareness creates layout problems. A layout designed without DFM awareness creates assembly problems. A design completed without safety analysis fails at the test lab.

At Pabst Electronics, all nine engineering disciplines operate simultaneously from the earliest project phases. Safety constraints inform component selection. EMC requirements shape the stack-up. DFM considerations influence footprint design. DFT requirements define test point placement. Signal integrity requirements determine routing rules.

The result is a design that does not just work โ€” it works correctly, passes certification, assembles reliably, tests efficiently, and lasts in the field.

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What You Receive

Complete Engineering Deliverables

Every project at Pabst Electronics results in a complete, professional engineering package โ€” not just files, but documented, traceable, production-ready deliverables.

๐Ÿ“ Design Files

Complete schematics, PCB Gerber/ODB++ files, BOM, pick-and-place files, and fabrication documentation ready for any manufacturing partner.

๐Ÿ“Š Analysis Reports

Insulation coordination, derating analysis, thermal analysis, worst-case circuit analysis, MTBF estimate, and signal integrity simulation report.

๐Ÿ“‹ Compliance Package

Compliance matrix, creepage/clearance analysis, technical construction file support, and pre-certification test plan aligned to applicable standards.

๐Ÿ”ฉ DFM Report

Design for manufacturability findings categorized by severity, with recommended changes, updated BOM, and assembly documentation.

๐Ÿงช Test Plans

ICT test plan, FVT test specification, end-of-line test procedure, pre-compliance test plan, and test report templates.

๐Ÿ’พ Firmware Package

Source code, hardware abstraction layer, communication protocol implementations, and software documentation โ€” delivered with full version control.

Ready to Discuss Your Project?

Tell us about your product, the standards it needs to meet, and the manufacturing context. The first conversation is always with an engineer.

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